【HTPADU 5028 交流专区】海德

icy97

Date of change	03 Apr 2024
Name	PUAN SALMI NADIA BINTI MOHD HILMEY
Age	42
Gender	Female
Nationality	Malaysia
Designation	Group Managing Director
Directorate	Executive
Type of change	Appointment

Qualifications

No	Qualifications	Major/Field of Study	Institute/University	Additional Information
1	Masters	Masters of Science (MsC) in Management and Information System	University of Nottingham, United Kingdom
2	Degree	Bachelor of Arts (B.A), Finance, Accounting and Management	Nottingham Trent University, United Kingdom

Working experience and occupation	Puan Salmi Nadia Binti Mohd Hilmey joined HeiTech in 2007. She was appointed as the Special Assistant to the GCEO in 2011 and later as Director of Corporate Development and Risk Management in 2014. Within these years, she has been responsible for all centralised functions under Corporate Services, while overseeing the operations and performance of all companies within HeiTech group.In January 2016, she was appointed as Executive Vice President, Risk Management and Corporate Services. Subsequently, Puan Salmi Nadia was appointed as the Head of Core 2, to lead more than ten (10) subsidiary companies in HeiTech Group in September 2018. She assumed the role of Group Chief Operating Officer on April 2021, before being appointed as the Group Chief Executive Officer of the Company on 2 October 2023, thereby taking on broader responsibilities within the Company.
Directorships in public companies and listed issuers (if any)	Nil
Family relationship with any director and/or major shareholder of the listed issuer	She is the daughter of Dato' Sri Mohd Hilmey Bin Mohd Taib, the Executive Deputy Chairman.
Any conflict of interests that he/she has with the listed issuer	Nil
Details of any interest in the securities of the listed issuer or its subsidiaries	Direct Interest - 1,000 Ordinary Shares

icy97

Type	Announcement
Subject	OTHERS
Description	ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR TENDER PERKHIDMATAN PENYELENGGARAAN DAN SOKONGAN TEKNIKAL BAGI INFRASTRUKTUR ICT SERTA SISTEM INFORMASI KENDERAAN DAN PEMANDU (mySIKAP) DIPUSAT DATA DAN SEMUA PEJABAT JABATAN PENGANGKUTAN JALAN MALAYSIA.
HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company had on 15th April 2024 accepted and signed the LOA from Road Transport Department Malaysia (“JPJ”) for Tender Perkhidmatan Penyelenggaraan dan Sokongan Teknikal bagi Infrastruktur ICT serta Sistem Informasi Kenderaan dan Pemandu (MySIKAP) dipusat Data dan semua pejabat JPJ. (“Contract”). Please refer to the attached file for details of the announcement. This announcement is dated 15th April 2024.

https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3437893

Attachments 20240415 - Announcement (JPJ).pdf

icy97

Type	Announcement
Subject	TRANSACTIONS (CHAPTER 10 OF LISTING REQUIREMENTS) NON RELATED PARTY TRANSACTIONS
Description	HEITECH PADU BERHAD BERHAD ("HEITECH" or "COMPANY") - TEAMING AGREEMENT ENTERED BETWEEN THE COMPANY AND MY E.G. SERVICES BERHAD
The Board of Directors of HeiTech Padu Berhad (“HeiTech” or “the Company”) wishes to announce that the Company had on 15th April 2024 entered into a Teaming Agreement (“the Agreement”) with MY E.G. Services Berhad (“MYEG”) to form an interim collaboration to explore services in relation to the Information Technology industry in Malaysia, subject to and upon the terms and conditions of the Agreement. Please refer to the attached file for details of the announcement. This announcement is dated 16th April 2024.

https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3438189

Attachments 20240416-Announcement (Teaming Agreement) FINAL.pdf

icy97

Type	Announcement
Subject	NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING
Description	HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")PROPOSED PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES" OR "SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PROPOSED PRIVATE PLACEMENT")
On behalf of the Board of Directors of HeiTech (“Board”), MIDF Amanah Investment Bank Berhad (“MIDF Investment”) wishes to announce that the Company proposes to undertake the Proposed Private Placement. The Proposed Private Placement shall be undertaken in accordance with the general mandate pursuant to Sections 75 and 76 of the Companies Act 2016 (“Act”) which was approved by the shareholders of HeiTech at the 28th annual general meeting of the Company held on 22 June 2023 whereby the Board has been authorised to issue and allot new HeiTech Shares not exceeding 10% of the total number of issued shares in the Company (“General Mandate”). Pursuant to the General Mandate, the Company had also obtained its shareholders’ approval to waive the statutory pre-emptive rights of the shareholders of HeiTech pursuant to Section 85 of the Act to be read together with Clause 52 of the Constitution of the Company to be offered new Shares pursuant to Sections 75 and 76 of the Act. Please refer to the attachment for further details of the Proposed Private Placement. This announcement is dated 17 April 2024.

https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3438630

Attachments HeiTech Padu Berhad - Proposed Private Placement Announcement.pdf

icy97

Notice of Person Ceasing (Section 139 of CA 2016)

HEITECH PADU BERHAD

Particulars of Substantial Securities Holder

Name	DATUK WIRA FARHASH WAFA SALVADOR
Nationality/Country of incorporation	Malaysia
Descriptions (Class)	Ordinary Shares
Name of registered holder	ROSETTA PARTNERS SDN BHD
Date of cessation	18 Apr 2024

No of securities disposed
Circumstances by reason of which a person ceases to be a substantial shareholder	Cessation of his deemed interest by virtue of the change in shareholdings in Mfivesouthsea Sdn Bhd, the holding company of Rosetta Partners Sdn Bhd pursuant to Section 8(4) of the Companies Act 2016.
Nature of interest	Deemed Interest
Date of notice	18 Apr 2024
Date notice received by Listed Issuer	18 Apr 2024